Organizers:

Hong Wang (wangh6@sustech.edu.cn), Southern University of Science & Technology, China

Xiangming Chen (xmchen59@zju.edu.cn), Zhejiang University, China

Zhifu Liu (liuzf@mail.sic.ac.cn), Shanghai Institute of Ceramics, CAS, China

Eung Soo Kim (eskim@kyonggi.ac.kr), Kyonggi University, Korea

Scope and topics:

As the fundamental building blocks of the components/devices for electromagnetic wave receiving, transmitting, and transferring, microwave dielectric materials played an important role in the evaluation of wireless communication technology. On the other hand, the evolution of wireless communication technology also stimulated the innovation of microwave dielectric materials and device technology. This session will bring together an international group of researchers from academics and industries to share their vision and insights for microwave dielectric materials, focusing on wide aspects, such as new design paradigm for advanced materials, novel synthesis strategy, advanced processing techniques, characterization techniques, and emerging applications. We expect that this session could boost the research and development of microwave dielectric materials and promote their applications in 5G/6G, IOT, V2X, satellite communication/navigation and other information systems.

The topics of this session will include but not limit to:

1. Novel microwave and millimeter-wave dielectric materials
2. LTCC/ULTCC materials
3. Cold sintering and other novel process for material preparation
4. Metamaterials, metasurface and advanced artificial structures
5. Microwave dielectric materials and devices design/modeling/simulation
6. Microwave dielectric materials and devices characterization
7. 3D printing /direct writing/photolithography and other emerging microwave/ millimeter wave devices fabrication/integration technologies
8. Components/devices/microsystems based on microwave dielectric materials
9. Microwave circuits package and integration
10. Other microwave dielectric materials related emerging topics

List of keynote and invited speakers (to be updated):

TBC